As of the date of this document, TopSolid incorporates the following software components:
PARASOLID of Siemens PLM Software, 13736 Riverport Drive, Maryland Heights, MO 63043, USA
MachineWorks technology of MachineWorks Ltd., 69 Clarkehouse Road, Sheffield S10 2LH, United Kingdom
REDSDK of RedWay3D SAS, 13 rue Raymond Losserand, 75014 Paris, France
Cadmould Essential of SIMCON kunststofftechnische Software GmbH, Schumanstr. 18 a, 52146 Würselen, Germany
PDFNet of PDFTron Systems, Inc., 3661 West 4th Ave., Suite #4, Vancouver, BC, V6R 1P2, Canada
3D InterOp of Spatial Corp., 310 Interlocken Parkway, Ste. 200 Broomfield, CO 80021-3468, USA
JT Open Toolkit of Siemens PLM Software, 5800 Granite Parkway Suite 600, Plano, TX 75024, USA
CrossCad/Ware of Datakit, 99 rue de Gerland F-69007 Lyon, France
Teigha of Open Design Alliance, 10645 N. Tatum Blvd. Suite 200-644, Phoenix, AZ 85028, USA
SketchUp of Trimble Navigation Limited, 935 Stewart Drive, Sunnyvale, California 94085, USA
Forming Technologies Incorporated, 3370 South Service Road, Burlington, ON, L7N 3M6, Canada
VoluMill of Celeritive Technologies Inc., 28248 N. Tatum Blvd. B-1, Suite 148, Cave Creek, AZ 85331, USA. This Product includes software developed by the OpenSSL Project for use in the OpenSSL Toolkit (http://openssl.org/). This Product includes cryptographic software written by Eric Young (eay@crypsoft.com).
MeshGems of Spatial Corp., 310 INTERLOCKEN PKWY #200, 80021 BROOMFIELD CO, USA
PowerNest of Alma, 15 rue Georges Perec, 38400 Saint Martin d'Hères, France
Eureka of Roboris Srl, Via Sterpulino, 1, 56121 Pisa PI, Italy
5 axis CAM Package of ModuleWorks GmbH Henricistraße 50 52072 Aachen, Germany
Open Image Denoise of Intel Corporation, 2200 Mission College Blvd., Santa Clara, CA 95054-1549, USA
FFTS of Anthony M. Blake, University of Waikato, Hamilton 3240, NEW ZEALAND
CM2 FEM of Computing Objects, 25 rue du Maréchal Foch, 78000 Versailles, FRANCE
LAPACK of Univ. of Tennessee; Univ. of California, Berkeley; Univ. of Colorado Denver; and NAG Ltd. under "Modified BSD" license available at : https://netlib.org/lapack/LICENSE.txt
"A Fast and Highly Quality Multilevel Scheme for Partitioning Irregular Graph". Georges Karypis and Vipin Kumar. SIAM Journal on Scientific Computing, Vol. 20, No 1, pp. 359-392, 1999
The Apache Software Foundation, 1000 N West Street, Suite 1200, Wilmington, DE 19801, USA
Licensed under the Apache License, Version 2.0 (the "License"); you may not use this file except in compliance with the License. You may obtain a copy of the License at http://www.apache.org/licenses/LICENSE-2.0
Unless required by applicable law or agreed to in writing, software distributed under the License is distributed on an "AS IS" BASIS, WITHOUT WARRANTIES OR CONDITIONS OF ANY KIND, either express or implied. See the License for the specific language governing permissions and limitations under the License.
OpenJDK, 1991 Free Software Foundation, Inc. 59 Temple Place, Suite 330, Boston, MA 02111-1307, USA
Adobe Substance SDK, Adobe Inc. This software contains Adobe Substance SDK code developed by Adobe Inc. © 2022 Adobe. All rights reserved.
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